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1. Surface Mount Technology (SMT) :

Surface mount technology, the manufacturing method of mounting components directly to the PCB surface, improves the density and performance of electronic products.

2. PCB (Printed Circuit Board) :

A printed circuit board is a plate-like carrier made of insulating material with conductive graphics printed on it for connecting and supporting electronic components.

3. Solder Paste:

The basic material of the solder joints, consisting of solder particles and a fluid adhesive, is used to coat the solder joints on the PCB.

4. Surface Mount Device (SMD) :

Small size, suitable for surface mounted electronic components such as resistors, capacitors, diodes, etc.

5. Reflow Oven:

The heating device is used to heat the entire PCB at a predetermined temperature to melt the solder paste and achieve welding.

6. Pick and Place Machine:

Automated equipment for fast and accurate selection and placement of SMD components.

7. AOI (Automated Optical Inspection) :

Using cameras and image processing software, the PCB surface patch components are automatically detected to ensure that their position and quality meet the requirements.